Corporate VP, Director of Substrate Packaging TD
Intel
Advisory Board
Deputy Chair: Markus Keil
Over 20 years Semiconductor Operations experience in Memory (Hitachi Semiconductor), iDM (AMD) and Foundry (GlobalFoundries) leading their Wafer Fab and adv. WLP package activities.
5 years CEO of a SME dealing with design and marketing leading edge optical inspection and review systems for Semiconductor customers.
Most recently responsible for the global operations and Supply chain management of a leading Power Semiconductor manufacturer (Littelfuse) integrating a recent acquisition and building the right supply chain for future growth and profitability.
Holds a degree of applied physics of College of Wiesbaden/Germany, is married and has 2 children.
Nextlens
Profile coming soon…
More Advisory Board Members
Dr. Xiaoning Qi
CEO
Alibaba Group
Alibaba Group
Vincent DiCaprio
VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
AMAT
AMAT
Jennifer Zhao
GM & EVP for Advanced Optical Sensors Division
ams
ams
Wei Wang
Asst. President, Director of Strategy Development
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
CEO
Axera Technology Co., Ltd
Axera Technology Co., Ltd
Martin Weigert
VP & GM Industrial Fiber Products Division
Broadcom
Broadcom
Amy Leong
Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
Formfactor
Formfactor
Dr. Qingchun Zhang
Professor
Fudan University
Fudan University
Farhat Jahangir
Co-founder & CEO
GS Microelectronics
GS Microelectronics
Vance Wang
Formerly VP New Fab Project
Formerly of GTA
Formerly of GTA
Dr. Yongxiang Wen
Process Technology Director
Hangzhou Silan Microelectronics Co Ltd
Hangzhou Silan Microelectronics Co Ltd
Chang Fu
Advanced Module R&D Dep., Deputy Director
HLMC
HLMC
Yaojian Lin
VP, GM of Technology R&D Center
JCET Group
JCET Group
Prof. Shaojun Wei
Professor
IME, Tsinghua University
IME, Tsinghua University
Prof. Tianchun Ye
Researcher Professor
Institute of Microelectronics, Chinese Academy of Sciences
Institute of Microelectronics, Chinese Academy of Sciences
JY Zhang
Chairman and CEO
MooreElite
MooreElite
Santosh Kumar
VP & Head, Semiconductor Manufacturing
Reliance India Ltd.
Reliance India Ltd.
Dr. Tim Yeh
Technical Director of Power BU
Sanan IC
Sanan IC
Andrew Peng
In Transition
Formerly of Spin Memory
Formerly of Spin Memory
Joseph Chou
GM
Suzhou Semitop Semiconductor Co Ltd
Suzhou Semitop Semiconductor Co Ltd
Dr. Key Chung
Advanced Packaging CTO
TongFu Microelectronics Co., Ltd
TongFu Microelectronics Co., Ltd
YC Lee
CEO
TRS China
TRS China
Weihua Cheng
COO
Yangtze Memory Technologies Co., Ltd (YMTC)
Yangtze Memory Technologies Co., Ltd (YMTC)
Dr. Wei Li
Chairman / EVP
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.