Advisory Board
Dr. Key Chung
C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 40 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.
TongFu Microelectronics Co., Ltd
Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu Microelectronics specializes in integrated circuit packaging and testing. Nantong Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu), Suzhou Tongfu Super Micro Semiconductor Co., Ltd. (TF-AMD Suzhou), TF AMD Microelectronics (Penang) Sdn. Bhd. (TF-AMD Penang) six major production bases. Through its own development and acquisitions, the company has become a local semiconductor multinational group company, China’s integrated circuit packaging and testing leader, the total number of employees of the group is more than 13,000 .
As a key undertaking unit of the National Major Science and Technology Projects (” 02 “Project), Tongfu Micro-Power has a state-recognized enterprise technology center, national post-doctoral research station, Jiangsu Provincial Engineering Technology Research Center and Advanced Information Technology Research Institute and other high-level research and development platforms, with a technical management team of more than 2000 people .
Tongfu Microelectronics is the first company in the industry to pass ISO9001, ISO/TS16949 and other quality systems. Adopt SAP, MES, equipment automation, EDI and other information systems, which can automatically control the production process according to the personalized specifications of customers, and carry out real-time information exchange with customers. Implement the “Tongfu Micro-electric Industry 4.0” project, comprehensively build a smart factory based on the Internet of Things, establish a flexible automated assembly line, and achieve a win-win situation with customers .
The development goal of Tongfu Microelectronics is to become a world-class integrated circuit sealing and testing enterprise. With the support of national policy and market, the demand of system manufacturers, the coordinated development of industrial chain, and the support of national industry fund and national major projects, Tongfu Micro will continue to march toward the goal of the world-class integrated circuit sealing and testing enterprise .
More Advisory Board Members
Chair: Dr. Hamid Azimi
Intel
Deputy Chair: Markus Keil
Nextlens
Dr. Xiaoning Qi
Alibaba Group
Vincent DiCaprio
AMAT
Jennifer Zhao
ams
Wei Wang
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
Axera Technology Co., Ltd
Martin Weigert
Broadcom
Amy Leong
Formfactor
Dr. Qingchun Zhang
Fudan University
Farhat Jahangir
GS Microelectronics
Dr. Yongxiang Wen
Hangzhou Silan Microelectronics Co Ltd
Chang Fu
HLMC
Yaojian Lin
JCET Group
Prof. Shaojun Wei
IME, Tsinghua University
Prof. Tianchun Ye
Institute of Microelectronics, Chinese Academy of Sciences
JY Zhang
MooreElite
Santosh Kumar
Reliance India Ltd.
Dr. Tim Yeh
Sanan IC
Andrew Peng
Formerly of Spin Memory
YC Lee
TRS China
Weihua Cheng
Yangtze Memory Technologies Co., Ltd (YMTC)
Dr. Wei Li
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.