Agenda – ISES China 2023 Day 1

ISES China 2023

17-18 October 2023

ISES China logo

Day 1 – October 17

Theme: Chiplet Leading the Change in the Next Chip Ecosystem

  • 08:00 – 08:40
  • Registration
  • 08:45 – 09:00
  • Welcome Speech
  • 09:05 – 09:15
  • Opening Speech  
  • 09:20 – 09:40
  • Keynote Speech  
  • 09:45 – 10:25
  • Executives Round Table Forum 
    Topic: Die-to-Die Link in Chiplet Architecture 
Moderator:
Confirmed Panelist:
Confirmed Panelist: 
Confirmed Panelist:
  • 10:30 – 11:00
  • Networking Break, Business Meeting 
  • 11:05 – 11:25
  • Chiplets and Advanced Heterogeneous Integration
  • 11:30 – 11:50
  • Chiplets and System Integration – Key Concepts and Implementation
  • 11:55 – 12:15
  • Heterogeneous integration enabled by advanced chiplet packaging
  • 12:20 – 12:40
  • The opportunity & challenge of OSAT for the coming chiplet integration package 
  • 12:45 – 13:45
  • Networking Lunch
  • 13:50 – 14:10
  • Chiplet Process Integration Based on Glass Substrate and TGV Process
  • 14:15 – 14:30
  • Memory and Processors for Chiplet designs

Equipment and Material Supplier

  • 14:35 – 14:55
  • Advanced Packaging Materials and Evaluation Platform at Resonac
  • 15:00 – 15:05
  • Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
  • 15:10 – 15:15
  • Tailored solutions for the semiconductor industry powered by TRUMPF
  • 15:20 – 15:25
  • Pushing the boundaries of thermal management to address challenges in wafer test and Advanced Packaging
  • 15:30 – 16:00
  • Networking Break, Business Meeting   
  • 16:05 – 16:45
  • Panel Discussion
    Topic: Focusing on the collaboration and leverage between UCIe and China Chiplet standards 
Moderator:
Panelist:
Panelist: 
Panelist:

Market Research

  • 16:50 – 17:10
  • Memory and Processors for Chiplet Designs
  • 17:15 – 17:20
  • Closing Remarks
  • 17:25 – 18:25
  • Networking Reception 
  • 18:30 – 20:30
  • Gala Dinner and Award Ceremony