Agenda – ISES China 2023 Day 1

ISES China 2023

17-18 October 2023

ISES China logo

Day 1 – October 17

Theme: Chiplet Leading the Change in the Next Chip Ecosystem

N.B. The agenda is subject to change without prior notice

  • 08:00 – 08:50
  • Registration
  • 09:00 – 09:15
  • Welcome Speech
Salah Nasri photo
Salah Nasri

President
ISES

  • 09:20 – 09:40
  • Chiplets and Advanced Heterogeneous Integration
  • 09:45 – 10:05
  • Chiplets and System Integration – Key Concepts and Implementation
  • 10:05 – 10:45
  • Networking Break, Business Meeting 
  • 10:50 – 11:10
  • Heterogeneous Integration Enabled by Advanced Chiplet Packaging
  • 11:15 – 11:35
  • Interconnection Define Computing: Key Technology for Next Generation Computing Paradigm Evolution
  • 11:40 – 12:00
  • The Opportunity & Challenge of OSAT for the Coming Chiplet Integration Package 
  • 12:05 – 13:15
  • Networking Lunch
  • 13:20 – 13:40
  • Chiplet Process Integration Based on Glass Substrate and TGV Process
  • 13:45 – 14:05
  • Memory and Processors for Chiplet Designs

Equipment and Material Supplier

  • 14:10 – 14:30
  • Advanced Packaging Materials and Evaluation Platform at Resonac
  • 14:35 – 14:40
  • Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
  • 14:45 – 14:50
  • Tailored Solutions for the Semiconductor Industry Powered by TRUMPF
  • 14:55 – 15:00
  • Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging
  • 15:05 – 15:45
  • Networking Break, Business Meeting   
  • 15:50 – 16:35
  • Panel Discussion
    Topic: Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards 
Moderator:
Panelist:
Panelist: 
Panelist:

Market Research

  • 16:40 – 17:00
  • Memory and Processors for Chiplet Designs
  • 17:05 – 17:10
  • Closing Remarks
  • 17:15 – 18:25
  • Networking Reception 
  • 18:30 – 20:30
  • Gala Dinner and Appreciation Award Ceremony