Agenda – ISES China 2022 Day 1

ISES China 2022

6-7 September 2022

Theme: MADE IN 2025 – The Semiconductor Objectives & Challenges Roadmap and Strengthening Global Collaborations

ISES China logo

Co-sponsor:

Huzhou Industrial Group logo

Day 1 – September 6

  • 07:45 – 08:15
  • Registration
  • 08:20 – 08:30
  • Welcome Speech
  • 08:35 – 08:45
  • Opening Address – Grade One Counsel of Shanghai Municipal Commission of Economy and Informatization – Xinhua Fu
  • 08:50 – 09:05
  • 09:10 – 09:20
  • Opening Remarks
  • 09:25 – 09:45
  • Semiconductor Equipment Market Trend and Third Industry Revolution
  • 09:50 – 10:30
  • CEO Panel
    Topic: Collaborative Strategy to Enhance China Semiconductor Ecosystem
Moderator:
Confirmed VIP Panelist: 
Confirmed Panelist: 
Confirmed Panelist: 
Confirmed Panelist: 
  • 10:35 – 11:35
  • Networking Coffee and Tea Break / Business Meetings 1 & 2
  • 11:40 – 12:00
  • New SiC MOSFET enabling a greener future

Advanced Packaging

  • 12:05 – 12:30
  • Innovations in advanced packaging to enable next generation heterogenous devices!
  • 12:35 – 13:35
  • Networking Buffet Lunch
  • 13:40 – 14:05
  • TSMC 3DFabricTM – a 3D chip stacking and advanced packaging solution
  • 14:10 – 14:35
  • Advance Package FAB Solutions (APFS) for Chiplet Integration of Emerging Applications
  • 14:40 – 15:00
  • Advanced Packaging: Enabling Moore’s Law’s next frontier through heterogeneous integration
  • 15:05 – 15:25
  • Heterogenous Integration: Simplifying Packaging Selection
  • 15:30 – 15:45
  • Technology pushes limits – Plating solutions for next generation power semiconductors and advanced packaging of highest reliability
  • 15:50 – 16:50
  • Networking Coffee and Tea Break / Business Meetings 3 & 4
  • 16:55 – 17:15
  • Recent development of chiplets

Equipment and Materials Suppliers

  • 17:20 – 17:30
  • Process Power Solution Provider for advanced Semiconductor Applications
  • 17:35 – 17:40
  • Process control solutions enabling high performance power devices and efficient manufacturing
  • 17:45 – 17:50
  • Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems
  • 17:55 – 18:00
  • Closing Remarks
  • 18:05 – 18:50
  • Networking Cocktail Reception
  • 19:00 – 21:00
  • Gala Dinner and Lucky Draw
    Lucky Draw sponsored by Thermo Fisher