CISES Speaker
Alan Lin
He has over 27 years’ experience in semiconductor processing technology R&D including nearly 14 years in TSMC R&D. His research interests and results cover advanced Cu/low-k interconnect in FEOL and 2.5D/3D advanced packaging in MEOL/BEOL. Was granted over 350 patents and published 11 technical papers.
SmartAiP(TM) for Ultra-Wideband 5G mm-Wave Commutation
SmartPoserTM, a 3D-SiP platform developed by SJSemi that can 3D integrate the entire power delivery subsystem into the package using non-TSV Vertical-InterConnect (V-IC) technology, enabling the integration both the active power dies and the voltage regulating passive SMT components directly underneath the computing die. Here we show the SmartPoserTM derived architecture has successfully resulted in a novel ultra-wideband(UWB) 5G mm-wave AiP for the first time in semiconductor history named SmartAiPTM.
The SmartAiPTM is simulated and measured to have UWB behavior with low return loss of -10dB~-40dB from 24GHz to 43GHz with 12.5dB stable gain, low cross polarization, low back-lobe radiation, as well as nearly identical E and H plane unidirectional radiation patterns thanks to precise wafer-level processing . SmartAiPTM ‘s UWB, low power consumption and slim form factor is a perfect fit for 5G mmWave handset application.
SJ Semiconductor (JiangYin) Corporation
Located in Jiangyin, SJSemi was founded in August 2014. It is the first dedicated 12” advanced Bumping Line in mainland China. SJSemi aims to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develop the advanced 3D-IC high density integration solutions to satisfy the sophisticated needs of Smart phone, AI, Big Data, Cloud Computing, 5G, AR, etc. It is committed to providing a convenient one-stop service to supply high quality and efficient chips for local and international customers, as well as help strengthen their global competitiveness.
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.