CISES Speaker
Dr. Wei Li
Dr. Li Wei graduated in 1994 from the Department of Mechanical Engineering, Tsinghua University and received his Master’s Degree of Materials Engineering in 1997 from Zhejiang University, followed by his Ph.D in 2000 from the Microelectronics at Shanghai Institute of Metallurgy CAS.
Dr. Li participated in the establishment of Simgui and has served many roles in that company since 2001, including: Assistant to the President; Vice President; and Secretary of the Board. Since 2017, Dr. Li has been the Chairman of Simgui.
Dr. Li assisted in the launch of Zing Semiconductor in 2014, and has also served multiple roles there, including: Board Member, Co-CEO and Legal Representative. From May 2019, he has been the Chairman of Zing Semiconductor.
Dr. Li also helped to initiate the founding of NSIG and served as EVP of the company. From 2017, he continues in his role as the Secretary of the Board of Directors.
Dr. Li was awarded the 1st Class Reward of National Technology Improvements, First Prize of Shanghai Science and Technology Progress Award, and Outstanding Scientific Achievement Reward. He was selected as Shanghai Model Worker and to the National Ten Thousand Talent Program in 2016. Dr. Li has been responsible for many national / local scientific research and industrialization projects.
Dr. Li also serves as Vice President of China Semiconductor Industry Association (CSIA) as well as Vice President of ICMTIA.
Topic: The Breakthroughs of 300mm silicon wafer in China
Abstract coming soon…
Zing Semiconductor Corporation
Zing Semiconductor was established in June 2014 and is controlled by National Silicon Industry Group. Zing is a high-tech company providing high quality 300 mm silicon wafers for IC chip manufacturing industry. The main products are 300 mm polished wafer, epitaxy wafer and test wafer. The products are usually widely used as silicon substrates for integrated circuit industries such as memory chips, logic and analog, IGBT power devices and mobile computing communication chips.
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.