CISES Speaker
Dr. Yun Zhang
Dr Yun Zhang, founder and CEO of Shinhao Materials LLC, has been active in materials innovation, R&D, marketing and sales for over 27 years, holding 26 granted patents, and numerous peer-reviewed journal publications. She started her career at AT&T Bell labs in 1994, carrying out materials research and development. Her work on tin whisker growth won international recognition for demonstrating experimentally for the first time its driving force and for developing mitigation solutions. In 2002, she was appointed global R&D director by Cookson Electronics Enthone for its electronics business. In the subsequent 10 years, her insight and leadership in fundamental understanding of electrodeposition process at a molecule level, combined with a deep appreciation of technology trends and customer needs has won Dr. Zhang many friends and willing partners at top tier equipment manufacturers and key customers. Those close and collaborative partnerships resulted in win-win to all parties for RDL, copper pillar and TSV plating. She received a BS in chemistry from Nanjing University, and a PhD in chemistry from Brown University.
All Copper Is Not Created Equal
Technology breakthrough in advanced packaging presents innovation opportunities for materials suppliers. Although copper electroplating has been one of the corner stone technologies for decades, there is an increasing need to better understand the impact of copper microstructure on the relevant electrical and thermal properties as well as mechanical strength. We will briefly show what we have learned using five different additive systems and hope to receive feedback from customers.
Shinhao Materials LLC
Shinhao Materials LLC is located in Suzhou China. Its mission is to invent and produce new materials to meet the ever-changing needs of the semiconductor industry, to service its customers in timely and cost-effective way. Being technology heavy, asset light, it has focused on technology innovation. Through its relatively short life, it has developed several unique classes of copper plating additives that have shown to be effective in addressing electrical, thermal, and stress challenges we are facing today. Its IntraCu® products are patent-protected in US, Korean, Taiwan and mainland China. To meet the challenge of chip shortage, Shinhao has developed a 2-in-1 copper plating process that can be used to manufacture both copper pillar and RDL. Furthermore, they can be used as “drop-in” replacement without sacrificing yield and cost. At the same time, it can significantly improve customer plating tool usage and productivity.
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.