Eric joined Amkor in 2014 and is currently Vice President responsible for Sales & Marketing in Greater China. He previously held business development and major account management roles as well. Prior to joining Amkor, Eric worked for CR Micro and HeJian Technology (Suzhou) Co., Ltd. He came to Amkor with 20 years of foundry and fabless semiconductor experience, focused on China market development. He holds a BS degree in Chemistry from National Cheng Kung University.
Automotive Semiconductor Packaging – Market Dynamics
As the automotive market is rapidly evolving, we are seeing an unprecedented adoption of semiconductor components, both established and leading-edge technologies. As a result, the requirement for automotive packaging is becoming more specific and diverse. Market focus is not only on conservative standards of reliability requirements but also pushing forward with demand for high performance packages. With this demand, advanced packages such as FCBGA, fcCSP and LDFO along with existing leadframe package are required to meet automotive requirements.
As the number one OSAT, Amkor has been working with many different advanced packages and introducing them to automotive semiconductor applications, resulting in shifting market dynamics driven by new challenges and trends.
Amkor Technology, Inc.
We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.
As a truly global supplier with a flexible supply chain, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.
Amkor Technology China
Zhangjiang Hi-Tech Park
Bldg. E, Chamtime Square
2889 Jinke Road, Room 504
Pudong, Shanghai 201203
Ext. 2340, 4034, 4221, 4245