CISES Speaker
Eric Hsiung
Eric joined Amkor in 2014 and is currently Vice President responsible for Sales & Marketing in Greater China. He previously held business development and major account management roles as well. Prior to joining Amkor, Eric worked for CR Micro and HeJian Technology (Suzhou) Co., Ltd. He came to Amkor with 20 years of foundry and fabless semiconductor experience, focused on China market development. He holds a BS degree in Chemistry from National Cheng Kung University.
Automotive Semiconductor Packaging – Market Dynamics
As the automotive market is rapidly evolving, we are seeing an unprecedented adoption of semiconductor components, both established and leading-edge technologies. As a result, the requirement for automotive packaging is becoming more specific and diverse. Market focus is not only on conservative standards of reliability requirements but also pushing forward with demand for high performance packages. With this demand, advanced packages such as FCBGA, fcCSP and LDFO along with existing leadframe package are required to meet automotive requirements.
As the number one OSAT, Amkor has been working with many different advanced packages and introducing them to automotive semiconductor applications, resulting in shifting market dynamics driven by new challenges and trends.
Amkor Technology, Inc.
As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.
We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.
As a truly global supplier with a flexible supply chain, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.
Amkor Technology China
Zhangjiang Hi-Tech Park
Bldg. E, Chamtime Square
2889 Jinke Road, Room 504
Pudong, Shanghai 201203
China
Tel: +86-21-5064-4590
Ext. 2340, 4034, 4221, 4245
Fax: +86-21-5048-2522
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.