CISES Speaker

Joshua Zhou

  • ERS electronic GmbH
  • VP and Director of ERS China
  • Biography

Mr Zhou Xiang (Joshua) is Vice President of ERS electronic GmbH and Head of ERS Greater China, based in Shanghai, China.

Mr. Zhou has a Bachelor Degree from Huazhong University of Science and Technology and a Master Degree in Communication Electronics from Tsinghua University. After graduation, he worked for Texas Instruments Incorporated for 11 years and then served as the Vice President of Operations and Sales for a well-known semiconductor design company in China. Mr. Zhou has always been committed to developing localized sales and marketing strategies and ensuring high quality customer service.

In 2018, Mr. Zhou joined ERS electronic GmbH – a German manufacturer of thermal management equipment for the semiconductor industry. Since then, he has developed a local team in Shanghai, which offers design, installation and after-sales support, and successfully introduced ERS’s thermal management solutions for wafer probing and Fan-out Advanced Packaging technologies to most of the large industry players in the Chinese market.

  • Presentation

Thermal Challenges in Wafer Probing and Fan-out Advanced Packaging

As the boundaries of semiconductor technologies are constantly being pushed, the functions and operation areas of IC devices for applications like electromobility, renewables, IoT and telecommunications overall, are becoming increasingly dependent on temperature. As a result, the need for reliable thermal regulation and management at wafer-level is more important than ever.

This presentation gives a brief overview of some of the biggest temperature challenges in the SC industry today and how they are being addressed with ERS’s wide portfolio of thermal management solutions. With more than 50 years of experience in thermal management, ERS has become a renowned manufacturer of Thermal Chuck systems for wafer probing and supplier of unique Debonding and Warpage Adjustment tools for eWLB Fan-Out Wafer and Panel Level Packaging (FOWLP/FOPLP).

ERS Electronic GmbH logo
  • Company Profile

ERS electronic GmbH

ERS electronic GmbH has been supplying innovative thermal management solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +550°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AirCool®3, is available for package-level tri-temp applications for MEMS test. We design and build stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. We also supply the advanced wafer level packaging market with its fully automatic debonding and manual warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide.

Phone: +49 (0)89 894132-0
Fax: +49 (0)89 8418766

Our products and services:

ERS electronic GmbH has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3 with patented heat exchange technology ACP, HTU, Anti-magnetic and High Voltage/Current thermal chuck are integral components in all larger-sized wafer probers across the semiconductor industry. Leveraging more than 50 years of thermal management expertise, ERS launched the first ever eWLB Thermal Debonding and Warpage Correction tool for Fan-out Advanced Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Fan-out space, by supporting different wafer formats and panels. The automatic FOPLP Thermal Debonding machine APDM is in development. For more information, please visit:

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