CISES Speaker
Jung Gang
Mr. Gang Jung joined JCET in 2021 as General Manager of the Automotive Business Unit. The recently established Automotive BU is responsible for leading JCET Group’s automotive readiness and analysis of automotive semiconductor market trends. Prior to JCET, Mr. Jung had worked at Harman Automotive as head of supplier quality for 14 years, where he gained experience in the management of semiconductor commodity suppliers.
Advanced Semiconductor Packaging Technologies for Automotive Applications
The requirements for automotive semiconductor packaging technology are increasing as the complexity of automotive chips increases, and packaging technology is becoming more and more important to the overall performance and reliability of automobiles. Only chips that meet strict safety standards can be used in cars. With the popularity of new energy vehicle and automatic or assisted driving functions, how to achieve better chip performance, higher stability, lower power consumption and faster time to market, through advanced packaging technologies such as wafer-level packaging and system-in-package, has become an issue that OSAT vendors need to address. By choosing a more suitable advanced packaging form, automotive chips can avoid interconnection bottlenecks and speed up the response time of critical systems. At the same time, technologies such as chiplets can quickly shorten the time to market. Finally, advanced packaging technology will also help the chip to still protect the good working condition of the chip in the harsh environmental conditions including long-term vibration, electromagnetic interference and extreme temperature.
JCET Group
JCET Group is a world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.
General Telephone: 021-38933500
General Email:
Website: www.jcetglobal.com
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.