Studied semiconductor physics and high vacuum technology in the Netherlands. Started working in semiconductor Industry in 1984 at ASM in front end equipment. Was at that time also involved with first sales of ASML Steppers. Later on worked at MRC in PVD and also Oerlikon/Unaxis being responsible for the materials and display groups. Started working for Besi in 2008 which included responsibility for plating and die attach product line and moved up to become the CTO of Besi.
Latest Developments in Advanced Packaging Equipment and Applications
The drive towards ever more densely packed semiconductor devices and higher performance is continuing. With front-end improvements, still ongoing but becoming more costly and complex additional improvements have to come from new and improved backend technologies. We will present latest developments in die bonding, molding and plating technology at Besi in application field like communication, compute, automotive and general applications. Latest developments bring backend technology to more front-end type specs. We will also review the upcoming photonics applications.
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI), its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands.