CISES Speaker

Zhong Han

  • Onto Innovation Inc
  • Sales Director of China Branch
  • Biography

Mr. Han Zhong has more than 20 years of experience in the semiconductor industry. He joined Rudolph in 2001, currently serving Onto Innovation China as a Sales Director.

For many years, Mr. Han has led the team to understand customers’ needs in the production process, and integrate the company’s product solutions to solve problems encountered on the production line, so as to improve the yield rate and production capacity for customers. Mr. Han has always been committed to ensuring high quality customer service in China, including providing customers with solutions for specific applications, and making outstanding contributions to cultivating good relationships with customers and cooperation partners.

Mr. Han Zhong possesses a Bachelor’s degree in Mechanical and Electronic Engineering from Tianjin University.

  • Presentation

2D/3D Inspection Solution for Advanced Packaging and Specialty Semiconductor Market

The advanced packaging and specialty semiconductor markets face several high-value challenges. For advanced packaging, the focus is on inspecting fine-pitch RDL and micro-bumps. For the CIS (CMOS) market, a primary concern is on low-contrast defect detection, while wafer dicing requires flawless crack inspection following the sawing process. As a result, surface inspection is more important than ever to ensure device quality and reliability. The next-generation of inspection and metrology platforms will need to improve sensitivity and throughput in order to become a best-in-class cost-of-ownership solution in the market. An inspection platform with 2D inspection and 3D metrology capabilities and sub-micron resolution can scan 2D more than 30% faster and 3D more than 50% faster than previous systems.

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  • Company Profile

Onto Innovation Inc

About Onto Innovation

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain help our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at



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