2023 Speaker
Abe Hidenori
Mr. Abe is leading R&D of semiconductor materials in general and promoting co-creation activities at Resonac, which is an integrated company of Showa Denko K.K. and Showa Denko Materials Co., Ltd., (formerly Hitachi Chemical Co., Ltd.), After serving as a General manager of CMP slurry business sector and a corporate marketing manager at Hitachi Chemical.
He was involved in the launch of the Packaging Solution Center, which is open innovation hub in advanced packaging development.
He had been engaged in the development of semiconductor molding compounds since 1998.
He holds an Executive MBA from Oxford, UK.
Advanced Packaging Materials and Evaluation Platform at Resonac
An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package.
Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package.
We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package.
Resonac Corporation
Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers.
In Greater China, we will support our customers’ businesses as a one-stop solution provider that covers technologies from upstream to downstream of the supply chain.
More 2023 Speakers
Haopeng Liu
AkroStar Technology Co., Ltd.
Jianmin Li
Amkor Assembly & Test (Shanghai) Co., Ltd.
Dr. Hongchao Liu
Anhui YOFC Advanced Semiconductor Co. Ltd
Dr. Stefan Pieper
Atotech
Dr. KK Kuo
ATX Semiconductor (Suzhou) Co., Ltd.
Laurent Giai-Miniet
ERS Electronic GmbH
Cheng-Tyng Yen
Fast SiC Semiconductor Inc.
Yupeng Xu
Forehope Electronic (Ningbo) Co., Ltd.
Dr. Richard Chang
GTA Semiconductor Co., Ltd.
Jiemin Cao
Hangzhou Silan Microelectronics Co., Ltd.
Dr. Rainer Kaesmaier
Hitachi Energy Switzerland Ltd
Dr. Hongliang Shi
Hunan Sanan Semiconductor Co., Ltd.
Mark Nils Münzer
Infineon Technologies AG
Prof. Qinfen Hao
Institute of Computing Technology, Chinese Academy of Science
Dr. Fengze Hou
Institute of Microelectronics of the Chinese Academy of Sciences
Dr. Yang Cheng
JCET Group Co., Ltd.
Simon Zhang
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
MoChen Tian
Kiwimoore
Dr. David Haynes
Lam Research
Dr. Tong Wu
onsemi
Kaisheng Ma
Polar Bear Tech
Dr. Victor Veliadis
PowerAmerica
Ralf Bornefeld
Robert Bosch
Dr. Terry Wu
Samsung Electronics
Luke Liu
UNISOC (Shanghai) Technologies Co., Ltd.
Francesco Muggeri
STMicroelectronics
Dariusz Czaja
TRUMPF Huettinger Electronics (Taicang) Co., Ltd.
Prof. Shaojun Wei
Tsinghua University
Markus Mosen
WeEn Semiconductors
Dr. Tamara Baksht
VisIC Technologies
Dr. Wenbiao Ruan
Xiamen Sky Semiconductor Technology Co., Ltd.
Simone Bertolazzi, PhD.
Yole Intelligence
Julian Fieres
ZF Friedrichshafen AG
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.