Mr. Abe is leading R&D of semiconductor materials in general and promoting co-creation activities at Resonac, which is an integrated company of Showa Denko K.K. and Showa Denko Materials Co., Ltd., (formerly Hitachi Chemical Co., Ltd.), After serving as a General manager of CMP slurry business sector and a corporate marketing manager at Hitachi Chemical.
He was involved in the launch of the Packaging Solution Center, which is open innovation hub in advanced packaging development.
He had been engaged in the development of semiconductor molding compounds since 1998.
He holds an Executive MBA from Oxford, UK.
Advanced Packaging Materials and Evaluation Platform at Resonac
An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package.
Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package.
We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package.
Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers.
In Greater China, we will support our customers’ businesses as a one-stop solution provider that covers technologies from upstream to downstream of the supply chain.