Dr. Fengze Hao photo
2023 Speaker

Dr. Fengze Hou

  • Institute of Microelectronics of the Chinese Academy of Sciences
  • Associate Professor
  • Biography

Fengze Hou is an IEEE senior member. He received his Ph.D. from the Delft University of Technology, Delft, The Netherlands, in 2020. In 2012, he joined the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), in Beijing, China. From 2013 to 2021, he was a senior engineer at the National Center for Advanced Packaging (NCAP), Wuxi, China. Dr Hou is an associate professor at the IMECAS. He has authored or coauthored over 60 articles in journals and international conferences and holds more than 20 patents. He first proposed the PCB-embedded SiC MOSFET packaging technology in the world. His interests cover chiplet and heterogeneous integration, advanced packaging, chip power delivery, thermal management, and thermo-mechanical reliability.

  • Presentation

Panel Topic: Focusing on the Collaboration and Leverage Between UCIe and China Chiplet Standards


  • Company Profile

Institute of Microelectronics of the Chinese Academy of Sciences

The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.

Company website: www.ime.ac.cn

More 2023 Speakers

Agenda 2023