Dr. Key Chung
C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 50 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.
Recent development of chiplets
Chiplets integrated package has been very hot these days, in particularly its applications on high performing computing（HPC）, artificial intelligent, big data, server farm and the rest. Since TSMC successfully launched its 2.5D and InFO packages. This market is flying with double digits growth. And this year Q1, the HPC revenue has become the top of TSMC revenues. Investments in these chiplets integrated packages are getting higher as we can partition the chips into smaller size for better yield, higher performances and lower costs. In this presentation, an overview of the chiplets integrated packages market and its trends are presented. Type of chiplets integrated package and their limitations are then shared. Last but not least, local market of chiplets integrated package is discussed.
Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu Microelectronics specializes in integrated circuit packaging and testing. Nantong Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu), Suzhou Tongfu Super Micro Semiconductor Co., Ltd. (TF-AMD Suzhou), TF AMD Microelectronics (Penang) Sdn. Bhd. (TF-AMD Penang) six major production bases. Through its own development and acquisitions, the company has become a local semiconductor multinational group company, China’s integrated circuit packaging and testing leader, the total number of employees of the group is more than 13,000 .
As a key undertaking unit of the National Major Science and Technology Projects (” 02 “Project), Tongfu Micro-Power has a state-recognized enterprise technology center, national post-doctoral research station, Jiangsu Provincial Engineering Technology Research Center and Advanced Information Technology Research Institute and other high-level research and development platforms, with a technical management team of more than 2000 people .
Tongfu Microelectronics is the first company in the industry to pass ISO9001, ISO/TS16949 and other quality systems. Adopt SAP, MES, equipment automation, EDI and other information systems, which can automatically control the production process according to the personalized specifications of customers, and carry out real-time information exchange with customers. Implement the “Tongfu Micro-electric Industry 4.0” project, comprehensively build a smart factory based on the Internet of Things, establish a flexible automated assembly line, and achieve a win-win situation with customers .
The development goal of Tongfu Microelectronics is to become a world-class integrated circuit sealing and testing enterprise. With the support of national policy and market, the demand of system manufacturers, the coordinated development of industrial chain, and the support of national industry fund and national major projects, Tongfu Micro will continue to march toward the goal of the world-class integrated circuit sealing and testing enterprise .