2023 Speaker
Dr. Terry Wu
Dr. Wu is currently working as Director of Business Development Team, AVP, Samsung Electronics. Prior to joining Samsung, he was CTO of Chengdu ESWIN System IC. He had also held several key positions in SJSemi and TSMC. Wu received DPhil in Inorganic Chemistry from Oxford University, and MS & BS degree in Chemical Engineering from National Taiwan University & National Chung Hsing University, respectively. Dr Wu was granted several awards in recognition of his contribution in Advanced Packaging, including 2018 Jiangshu Innovative & Entrepreneurial Talent Award, 2019 Wuxi Taihu Talent Award, 2021 Chengdu Golden Panda Talent Program, and 2022 CSTIC Best Young Engineer Award from SEMICON China. He has 14 journal and conference papers, with over 680 citations and H-index of 11. He also holds 40 US patents and 144 China patents on microelectronic packaging.
Chiplets and Advanced Heterogeneous Integration
With the ever-increasing demand for computing performance for mobile, IoT, AI, Big Data and automotive applications, the need for new solutions is growing due to the slowdown of Moore’s Law and computing power solutions. Heterogeneous integration is one of the key platforms to enable higher bandwidth and density for HPC and AI systems. This presentation will discuss how chiplets and advanced heterogeneous integration are enabling next generation computing.
Samsung Electronics
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
More 2023 Speakers
Haopeng Liu
AkroStar Technology Co., Ltd.
Jianmin Li
Amkor Assembly & Test (Shanghai) Co., Ltd.
Dr. Hongchao Liu
Anhui YOFC Advanced Semiconductor Co. Ltd
Dr. Stefan Pieper
Atotech
Dr. KK Kuo
ATX Semiconductor (Suzhou) Co., Ltd.
Laurent Giai-Miniet
ERS Electronic GmbH
Cheng-Tyng Yen
Fast SiC Semiconductor Inc.
Yupeng Xu
Forehope Electronic (Ningbo) Co., Ltd.
Dr. Richard Chang
GTA Semiconductor Co., Ltd.
Jiemin Cao
Hangzhou Silan Microelectronics Co., Ltd.
Dr. Rainer Kaesmaier
Hitachi Energy Switzerland Ltd
Dr. Hongliang Shi
Hunan Sanan Semiconductor Co., Ltd.
Mark Nils Münzer
Infineon Technologies AG
Prof. Qinfen Hao
Institute of Computing Technology, Chinese Academy of Science
Dr. Fengze Hou
Institute of Microelectronics of the Chinese Academy of Sciences
Dr. Yang Cheng
JCET Group Co., Ltd.
Simon Zhang
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
MoChen Tian
Kiwimoore
Dr. David Haynes
Lam Research
Dr. Tong Wu
onsemi
Kaisheng Ma
Polar Bear Tech
Dr. Victor Veliadis
PowerAmerica
Abe Hidenori
Resonac Corporation
Ralf Bornefeld
Robert Bosch
Luke Liu
UNISOC (Shanghai) Technologies Co., Ltd.
Francesco Muggeri
STMicroelectronics
Dariusz Czaja
TRUMPF Huettinger Electronics (Taicang) Co., Ltd.
Prof. Shaojun Wei
Tsinghua University
Markus Mosen
WeEn Semiconductors
Dr. Tamara Baksht
VisIC Technologies
Dr. Wenbiao Ruan
Xiamen Sky Semiconductor Technology Co., Ltd.
Simone Bertolazzi, PhD.
Yole Intelligence
Julian Fieres
ZF Friedrichshafen AG
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.