2023 Speaker
Jianmin Li
Jianmin joined Amkor Assembly & Test (Shanghai) Co. Ltd since 2013. He is responsible for RnD organization including design and new package / process development. The team developed various package type including memory SCSP, flip chip package, SiP and sensor packages under his leadership. He has more than 20 years of experience in semiconductor assembly engineering area. Prior to joining Amkor, Jianmin worked in process engineering at Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.
Chiplets and System Integration – Key Concepts and Implementation
In this presentation, Jianmin Li, Director of R&D at Amkor Technology – China, discusses the key concepts and implementations of chiplets and system integration. Li highlights the strong trends in chiplets and heterogeneous integration products, which offer new ways to achieve innovative product architectures while maintaining optimal Performance/Power/Area/Cost (PPAC) ratios for the future of the industry. Li emphasizes the need for advanced IC packaging capabilities to support these approaches, and notes that OSATs and Foundries are actively responding to enable this integration.
The presentation emphasizes the importance of starting with a 2D module and augmenting it with 3D as necessary for enhanced performance and differentiation. Additionally, Li mentions Amkor’s involvement as a contributor member of the UCIe™ ecosystem, which aims to define next-generation computing standards. Overall, this presentation provides valuable insights into the evolving landscape of chiplets and system integration, positioning the speaker as a seasoned professional in the field.
Amkor Assembly & Test (Shanghai) Co., Ltd.
Profile coming soon…
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