2023 Speaker
MoChen Tian
In 2021, he founded Kiwimoore and assumed the role of CEO. Kiwimoore is among the world’s pioneering companies, focusing on universal interconnect chiplets and system-level solutions. These are built on next-gen computing architecture and offer leading high-performance general-purpose chiplets and solutions. Their aim to enable high-computing power chips to achieve a significant leap in performance.
Former Global Vice President of NXP Semiconductors, he was accountable for marketing and team management in Greater China, encompassing Smart ID, MCU, Mobile, IoT, and other product lines.
He successfully spearheaded the product line definition in China, overseeing the entire process from market demand assessment to specification definition and product realization. This effort resulted in cumulative product lifecycle sales of $5 billion.
Previously, he served as the Head of Marketing Asia Pacific in the Chipcard & Security Division at Infineon Technologies.
Executives Round Table Forum – Topic: Die-to-Die Link in Chiplet Architecture
Panelist
Kiwimoore
Founded in early 2021, Kiwimmore is among the world’s pioneering companies, offering “universal interconnect chiplets and system-level solutions” based on the Chiplet architecture，our primary product lineup comprises two types of products: High-speed interconnect IO Die
and High-performance interconnect Base Die. Additionally, we provide a series of Die2Die IPs, Chiplet software design platforms, and other hardware and software products.
We target the AIGC-driven high-performance computing markets, such as data centers, autonomous driving, personal computing platforms, and more. Our company is dedicated to delivering chiplet system-level solutions with the interconnect chiplets. These solutions are designed to assist our customers in expediting the development of intricate, high-computing-power chips in a more efficient manner.
More 2023 Speakers
Haopeng Liu
AkroStar Technology Co., Ltd.
Jianmin Li
Amkor Assembly & Test (Shanghai) Co., Ltd.
Dr. Hongchao Liu
Anhui YOFC Advanced Semiconductor Co. Ltd
Dr. Stefan Pieper
Atotech
Dr. KK Kuo
ATX Semiconductor (Suzhou) Co., Ltd.
Laurent Giai-Miniet
ERS Electronic GmbH
Cheng-Tyng Yen
Fast SiC Semiconductor Inc.
Yupeng Xu
Forehope Electronic (Ningbo) Co., Ltd.
Dr. Richard Chang
GTA Semiconductor Co., Ltd.
Jiemin Cao
Hangzhou Silan Microelectronics Co., Ltd.
Dr. Rainer Kaesmaier
Hitachi Energy Switzerland Ltd
Dr. Hongliang Shi
Hunan Sanan Semiconductor Co., Ltd.
Mark Nils Münzer
Infineon Technologies AG
Prof. Qinfen Hao
Institute of Computing Technology, Chinese Academy of Science
Dr. Fengze Hou
Institute of Microelectronics of the Chinese Academy of Sciences
Dr. Yang Cheng
JCET Group Co., Ltd.
Simon Zhang
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
Dr. David Haynes
Lam Research
Dr. Tong Wu
onsemi
Kaisheng Ma
Polar Bear Tech
Dr. Victor Veliadis
PowerAmerica
Abe Hidenori
Resonac Corporation
Ralf Bornefeld
Robert Bosch
Dr. Terry Wu
Samsung Electronics
Luke Liu
UNISOC (Shanghai) Technologies Co., Ltd.
Francesco Muggeri
STMicroelectronics
Dariusz Czaja
TRUMPF Huettinger Electronics (Taicang) Co., Ltd.
Prof. Shaojun Wei
Tsinghua University
Markus Mosen
WeEn Semiconductors
Dr. Tamara Baksht
VisIC Technologies
Dr. Wenbiao Ruan
Xiamen Sky Semiconductor Technology Co., Ltd.
Simone Bertolazzi, PhD.
Yole Intelligence
Julian Fieres
ZF Friedrichshafen AG
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Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
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Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.