Professor
Tsinghua University, IME
2022 Speaker
Ning Jin
Coming soon…
Topic TBC
Abstract coming soon…
Huzhou Industrial Group
Profile coming soon…
More 2022 Speakers
VIP Panelist: Dr. Haijun Zhao
Co-Chief Executive Officer
SMIC
SMIC
Keynote: Dr. Gerald Yin
Chairman and CEO
Advanced Micro-Fabrication Equipment Inc. China (AMEC)
Advanced Micro-Fabrication Equipment Inc. China (AMEC)
Keynote: Rahul Manepalli
Intel Fellow and Sr. Director of Module Engineering
Intel
Intel
Keynote: Dr. Marvin Liao
VP Advanced Packaging and Technology Service
TSMC
TSMC
Keynote: Dr. Seungwook Yoon
Corporate VP/Head of Team of Package Technology Strategy and Planning
Samsung Electronics
Samsung Electronics
Keynote: Francesco Muggeri
Vice President, Power Discrete and Analog Products, Asia Pacific
STMicroelectronics
STMicroelectronics
Markus Mosen
CEO
WeEn Semiconductors
WeEn Semiconductors
Dr. Raja Swaminathan
Corporate VP, Advanced Packaging
AMD
AMD
Mike Kelly
VP Advanced Package & Technology Integration
Amkor Technology, Inc
Amkor Technology, Inc
Dr. Chengyu Wang
Senior Director
Applied Materials
Applied Materials
David Song
CG Engineering Director
Aptiv China Technical Center
Aptiv China Technical Center
Dr. Christian Ohde
Global Director Semiconductor and Functional Electronics
Atotech
Atotech
Dr. KK Kuo
Vice President of R&D Center
ATX Group
ATX Group
Wei Wang
Assistant President; Director of Strategy Development
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Pei Yi
VP Technology
Dynax Semiconductor, Inc.
Dynax Semiconductor, Inc.
Dr. Guanyin Lei
Professor
Fudan University
Fudan University
Taiyi Cheng
CEO
GigaDevice
GigaDevice
Dr. Minhwa Chi
Top Scientist, SVP TD
GTA Semiconductor
GTA Semiconductor
Youwen Fu
Device Product Line Director
Hangzhou Silan Microelectronics Co Ltd
Hangzhou Silan Microelectronics Co Ltd
Alex Yuejie Gu
IGBT Technical Director
Hangzhou Silan Microelectronics Co Ltd
Hangzhou Silan Microelectronics Co Ltd
Dr. Jianyong Zhang
Co-Founder
Huixi Technology Co.,Ltd.
Huixi Technology Co.,Ltd.
TK Gu
Assistant General Manager & Senior Expert of Technology Center
Hunan Sanan Semiconductor Co Ltd
Hunan Sanan Semiconductor Co Ltd
Dr. Weiwei Luo
Chairman
Innoscience
Innoscience
Dr. David Haynes
VP, Specialty Technologies Strategy
Lam Research
Lam Research
Dr. Wei Zhao
Strategic Marketing Director
Onto Innovation
Onto Innovation
Ben Yang
MCU BU GM
Shenzhen CVA Innovation Co Ltd
Shenzhen CVA Innovation Co Ltd
Dr. Key Chung
Advanced Packaging CTO
TongFu Microelectronics
TongFu Microelectronics
Michael Ehinger
Vice President, Sales, Service & Marketing
TRUMPF Hüttinger GmbH + Co. KG
TRUMPF Hüttinger GmbH + Co. KG
Prof. Jin Huang
Associate Professor
Tsinghua University, School of Vehicle and Mobility
Tsinghua University, School of Vehicle and Mobility
Dr. Shalu Agarwal
Senior Technology and Market Analyst
Yole Développement, France
Yole Développement, France
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.