Prof. Shaojun Wei
Prof. WEI received Master degree in Engineering from the Department of Radio and Electronics, Tsinghua University, Beijing, China in 1984 and Doctor degree in Applied Science in 1991 from the Laboratory of Electronics, Faculté Polytechnique de Mons, Belgium and then became the assistant professor in the same laboratory. From 1989 to1991, he also worked as a research fellow in ARAMIS, Belgium. Dr. WEI returned to China in 1995. From 1998 to 2005, he worked for Datang Telecom Technology Co., Ltd. successively as Vice-President, President & CEO. He was the founder, President & CEO and Chairman of the Board of Datang Microelectronics Technology Co., Ltd. from 1996 to 2005. He was the CTO of Datang Telecom Industry Group from 2005 to 2006.
Dr. WEI is now professor of Tsinghua University and adjunct professor of Peking University. Dr. WEI is the Vice President of CSIA, President of VLSI fables chapter, CSIA. He is the fellow of CIE and the fellow of IEEE.
The research interests of Dr. WEI are VLSI design methodology, communication specific IC development, mobile computing and reconfigurable computing. He has published more than 200 papers in above area.
Dr. WEI has won many awards during last years, including the National 2nd Prize for Advanced Technology in 2002; the National 2nd Prize for Technology Invention in 2015; Beijing 1st and 2nd Prize for Advanced Technology in 2001 and 2004; the Award for Outstanding Chinese Patented Invention, State Intellectual Property Office of China & World Intellectual Property Organization in 2004; the Outstanding Founder in ZhongGuanCun Science Park in 2001 and the Outstanding Leading Person in Semiconductor Industry, CSIA in 2003; China ACE Award – Lifetime Achievement Award of China Semiconductor Industry, Global Source, in 2014; 2018 China IC Design Award – Outstanding Contributor to China IC Industry, EETIMS; 2018 World Electronics Achievement Award – Contributor of the year, ASPENCORE；SEMI Special Contribution Award, IEEE 2020 CAS Industrial Pioneer Award, etc.
Abstract coming soon…
Tsinghua University, IME
Profile coming soon…