中国国际半导体高管峰会议程

ISES China 2022

2022.9.6 – 9.7

主题:制造2025 – 半导体的目标与挑战路线图和加强全球合作

ISES China logo

Co-sponsor:

Huzhou Industrial Group logo

峰会第一天 – 2022.9.6

  • 07:45 – 08:15
  • 签到
  • 08:20 – 08:30
  • 欢迎致词
  • 08:35 – 08:45
  • 开幕致词 – 任市经济信息化委一级巡视员 -傅新华
  • 08:50 – 09:05

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  • 09:10 – 09:20
  • 主旨致辞
  • 09:25 – 09:45
  • 中微公司 – 尹志尧博士,董事长兼首席执行官

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  • 09:50 – 10:30
  • CEO讨论会
    题目: 加强中国半导体生态系统的合作战略
主持人:
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  • 10:35 – 11:35
  • 交流茶席、商务会议
  • 11:40 – 12:00
  • 新碳化硅MOSFET正在打造更加绿色的未来

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先进封装

  • 12:05 – 12:30
  • Innovations in advanced packaging to enable next generation heterogenous devices!

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  • 12:35 – 13:35
  • 交流午餐
  • 13:40 – 14:05
  • TSMC 3DFabricTM – a 3D chip stacking and advanced packaging solution

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  • 14:10 – 14:35
  • Advance Package FAB Solutions (APFS) for Chiplet Integration of Emerging Applications

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  • 14:40 – 15:00
  • Advanced Packaging: Enabling Moore’s Law’s next frontier through heterogeneous integration

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  • 15:05 – 15:25
  • 异构集成:简化封装选择

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  • 15:30 – 15:45
  • Technology pushes limits – Plating solutions for next generation power semiconductors and advanced packaging of highest reliability

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  • 15:50 – 16:50
  • 交流茶席、商务会议
  • 16:55 – 17:15
  • 小芯片的近期发展

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设备和材料供应商报告

  • 17:20 – 17:30
  • Process Power Solution Provider for advanced Semiconductor Applications

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  • 17:35 – 17:40
  • Process control solutions enabling high performance power devices and efficient manufacturing

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  • 17:45 – 17:50
  • Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems

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  • 17:55 – 18:00
  • 闭幕致词
  • 18:05 – 18:10
  • 交流酒会
  • 19:00 – 21:00
  • 晚宴、抽奖
    抽奖赞助商:赛默飞世尔科技