中国国际半导体高管峰会议程

ISES China 2022

2022.9.6 – 9.7

主题:制造2025 – 半导体的目标与挑战路线图和加强全球合作

ISES China logo

Co-sponsor:

Huzhou Industrial Group logo

峰会第二天 – 2022.9.7

  • 08:00 – 08:30
  • 签到

功率半导体

  • 08:45 – 09:05
  • Si, SiC, GaN: Which technology best fits the various applications?
  • 09:10 – 09:30
  • 面向下一代移动通讯的氮化镓射频器件
  • 09:35 – 09:55
  • How vertical integration empower the SiC power device foundry?
  • 10:00 – 11:00
  • 交流茶席、商务会议
  • 11:05 – 11:25
  • 士兰微电子助力新能源产业发展
  • 11:30 – 11:50
  • Advanced technologies of SiC power devies with high reliability for automotive applications
  • 11:55 – 12:15
  • Status and future perspectives of silicon carbide power devices
  • 12:20 – 13:20
  • 交流午餐
  • 13:25 – 13:40
  • GaN/SiC  System Revolution in Power Electronics
  • 13:45 – 14:05
  • How will the growing EV market impact the power module packaging technologies?
  • 14:10 – 14:40
  • Panel Discussion
    Topic: Who is the winner of Power MOS, from Si to SiC, GaN
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  • 14:45 – 15:45
  • 茶歇、商务会议

汽车

  • 15:50 – 16:10
  • 国产汽车芯片供应商的机会与挑战
  • 16:15 – 16:35
  • 车载半导体的标准和认证
  • 16:40 – 17:10
  • 汽车与芯片之间的小组讨论:汽车产业的改革与车载半导体的影响
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  • 17:15 – 17:20
  • 闭幕致辞