博士

抱歉，此内容目前仅提供英文版 David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications.

In his professional career, David has accrued more than 20 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors with STS, SPTS and Oxford Instruments. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies.

Building on this technical knowledge, David has a proven track record in developing strategic business partnerships; specialising in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide.

David Joined Lam Research in June 2016 and is currently Managing Director of Strategic Marketing in Lam’s Customer Support Business Group.

Enabling Specialty Technologies and Advanced Packaging Solutions to Improve the Functionality and Performance of Electronic Systems

随着技术节点的扩展日趋复杂且成本高昂，越来越多的半导体制造商和代工厂将目光投向开发特殊技术和先进封装解决方案，力求在控制开发成本的同时，提升系统功能和性能。

如传感器（MEMS、CIS和IR传感器）、RF设备、光电子、先进功率半导体(MOSFET和IGBT）、双极CMOS DMOS（BCD）电源管理IC等特种技术，是实现消费性电子产品、汽车用电子设备、物联网应用、蜂窝通信乃至5G应用的关键。这一趋势意味着到2023年，这些特殊技术将占全球IC需求的30%左右1。

与此同时，单芯片解决方案的高扩展成本也推动了芯片异构集成的发展。异构集成方案采用先进封装技术，重点是将多个芯片和功能集成到一个组件中。虽然这在概念上与多芯片模块非常相似，但最近出现了一个新发展趋势，即采用先进晶圆制造技术，以满足不断增长的性能和形状要求。

在本次演示中，我们将进一步探讨特种技术发展趋势和基于高级封装技术的异构集成发展，以及如何通过大容量CMOS制造解决方案解决这些应用面临的技术挑战。

¹ IC Insights，McClean年中预测，2021年7月；OSD报告，2021年3月