
CISES 演讲者
郑刚
郑刚先生于 2021 年加入 JCET,担任汽车电子事业部总经理。长电科技汽车电子事业部于2021年成立,负责长电科技汽车半导体业务开展和市场趋势分析。在加入 JCET 之前,郑刚先生曾在 哈曼汽车(Harman Automotive)担任供应商质量主管 14 年,拥有丰富的管理半导体商品供应商的经验。
先进封装技术在汽车芯片中的应用
对汽车芯片封装技术的要求正随着汽车芯片的复杂性增加而提升,而封装技术对汽车的整体性能和可靠性也愈发重要。只有满足严格的安全标准的芯片才能在汽车中使用。随着新能源汽车技术以及自动或辅助驾驶功能的普及,如何通过晶圆级封装、系统级封装等先进封装技术实现更好的芯片性能、更高的稳定性、更低的功耗以及更快的上市时间,则成为OSAT厂商需要重点解决的问题。通过选择更适合的先进封装形式,汽车芯片可以避免互联瓶颈,加快关键系统的响应时间,同时通过小芯片(Chiplet)等技术的系统级封装则能够迅速缩短上市时间。最后,先进封装技术也将帮助芯片在恶劣的环境条件和长期振动、电磁干扰和极端温度的使用场合中,仍然保护芯片内部良好的工作状态。

长电科技
抱歉,此内容目前仅提供英文版 JCET Group is a world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.
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