Hamid Azimi

Chair: Dr. Hamid Azimi

Corporate VP, Director of Substrate Packaging TD

Intel

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Markus Keil

Deputy Chair: Markus Keil

VP Global Semiconductor Operations/COO

Nextlens

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Dr. Xiaoning Qi photo

Dr. Xiaoning Qi

VP

Alibaba Group

Alibaba DAMO Academy logo
Vincent Dicaprio photo

Vincent DiCaprio

VP Advanced Packaging and ICAPS / Head of Business and Corporate Development

AMAT

Applied Materials logo
Jennifer Zhao

Jennifer Zhao

GM & EVP for Advanced Optical Sensors Division

ams

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Wei Wang photo

王微

Asst. President, Director of Strategy Development

清华大学苏州汽车研究院(吴江)

Automotive Research Institute (Suzhou), Tsinghua University (TSARI) logo
Dr. Xiaoxin Qiu

仇肖莘博士

首席执行官

Axera Technology Co., Ltd

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Dr. Alan Zhou photo

Dr. Alan Zhou

首席执行官

BelGan

BelGaN
Martin Weigert photo

Martin Weigert

VP & GM Industrial Fiber Products Division

Broadcom

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Amy Leong

Amy Leong

Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions

Formfactor

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Dr. Qingchun Zhang photo

Dr. Qingchun Zhang

Professor

Fudan University

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Dr. Yongxiang Wen photo

闻永祥

工艺技术总监

Hangzhou Silan Microelectronics Co Ltd

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Chang Fu photo

傅昶

先进模块研发部,副部长

HLMC

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Yaojian Lin photo

Yaojian Lin

VP, GM of Technology R&D Center

长电科技

JCET Group logo
Prof. Shaojun Wei

魏少军教授

Professor

IME, Tsinghua University

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Prof. Tianchun Ye photo

叶甜春教授

Researcher Professor

Institute of Microelectronics, Chinese Academy of Sciences

Institute of Microelectronics, Chinese Academy of Sciences logo
Dr. Dong Yemin photo

Dr. Dong Yemin

首席执行官

SITRI

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Jingyang Zhang photo

JY Zhang

Chairman and CEO

摩尔精英

MooreElite
Santosh Kumar photo

Santosh Kumar

VP & Head, Semiconductor Manufacturing

Reliance India Ltd.

Dr. Tim Yeh photo

Dr. Tim Yeh

Technical Director of Power BU

Sanan IC

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Dr. Key Chung photo

郑子企博士

先进封装CTO

通富微电子股份有限公司

TongFu Microelectronics Co., Ltd logo