Chair: Dr. Hamid Azimi
Intel
EDUCATION:
1. S.M.U. Dallas,Tx,USA
2. N.T.U.T Tapei,TW
WORKING EXPERIENCE:
GTA Semi V.P.[New Fab start up] – 2018/8~up to now
-1st pillar to tool move in –499 days
– Mini line tools installation/Pi-run succeed with yield greater than 95%
SMIC senior Director – 2001/3~2018/7
– 2004/6~2018/7
SMIC BJ Fab4C Fab director, SMNC Tech support senior director in charge of PC,IE,IT,Product,Quality departments
– 2001/3~2004/5
SMIC Fab1 PIE department manager
TSMC Y.E.Section manager 2000/1~2001/3
– 300mm start up team /YE section manager
V.I.S.C [Vanguard] 1994/5~1999/12
– Fab YE senior Engineer
KLA Taiwan 1991/12~1994/5
– Service Manager PATENT USA 6143596 :Planarization for interlayer directric USA 6037220 Method of increasing the surface area of a DRAM capacitor structure via the use of hemispherical
即将公布
中國國際半導體高峰會
2023.10.17-18
晶圆厂 / 封装测试厂 / 集成电路设计公司 / 终端用户
会员资格是基于日历年,从2023年1月1日开始至2023年12月31日结束
所有额外的活动通行证将以较低的会员费率注册。
注册ISES活动通行证时节省会员费用的一个例子。
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
Member Rate: $800 per person
Non-Member Rate: $2,800 per person
Plus 7.5% service charge
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
即将公布