郑晨焱

Corporate VP, Director of Substrate Packaging TD
Intel

VP Global Semiconductor Operations/COO
Nextlens

VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
AMAT

VP
Alibaba Group

GM & EVP for Advanced Optical Sensors Division
ams

Asst. President, Director of Strategy Development
清华大学苏州汽车研究院（吴江）

VP & GM Industrial Fiber Products Division
Broadcom

首席执行官
Axera Technology Co., Ltd

Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
Formfactor

Professor
Fudan University

Co-founder & CEO
GS Microelectronics

Formerly VP New Fab Project
Formerly of GTA

工艺技术总监
Hangzhou Silan Microelectronics Co Ltd

先进模块研发部，副部长
HLMC

VP, GM of Technology R&D Center
长电科技

Professor
IME, Tsinghua University

Researcher Professor
Institute of Microelectronics, Chinese Academy of Sciences

Chairman and CEO
摩尔精英

Chairman / Chairman & CEO
OSFPGA Foundation / Rapid Silicon

VP & Head, Semiconductor Manufacturing
Reliance India Ltd.

Technical Director of Power BU
Sanan IC

In Transition
Formerly of Spin Memory

GM
Suzhou Semitop Semiconductor Co Ltd

先进封装CTO
通富微电子股份有限公司

首席执行官
TRS China

COO
Yangtze Memory Technologies Co., Ltd (YMTC)

Chairman / EVP
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group