Chair: Dr. Hamid Azimi
Intel
Andrew Peng joins Spin Memory as Vice President of Business Development.
With 30 years of experience establishing and growing new business and building alliances and new partnerships with electronics companies, Andrew has held various engineering and leadership roles in semiconductor companies and semiconductor-related companies. Most recently, he was chief strategy officer and vice president of Business Development — North America and Europe for Tongfu Microelectronics Co., Ltd., where he developed new businesses and oversaw M&A opportunities. Prior to Tongfu Microelectronics, he held positions at GEM Services, Inc., Mosel Vitelic Corp. (MVC), Hitachi Semiconductor (America) Inc., Integrated Silicon Solution Inc. (ISSI) and National Semiconductor.
Andrew is also responsible for establishing JEDEC, the Joint Electron Device Engineering Council to partner with potential member electronics companies and relevant organizations participating in the development of open industry standards to establish a region memory ecosystem.
Andrew earned M.S.E.E. and M.B.A. degrees from San Jose State University, CA, where he also was an instructor for digital and analog engineering lab courses with the School of Engineering.
即将公布
中國國際半導體高峰會
2023.10.17-18
晶圆厂 / 封装测试厂 / 集成电路设计公司 / 终端用户
Memberships are based on calendar year. It commences 1st January 2023 and ends on 31st December 2023.
所有额外的活动通行证将以较低的会员费率注册。
注册ISES活动通行证时节省会员费用的一个例子。
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
Member Rate: $800 per person
Non-Member Rate: $2,800 per person
Plus 7.5% service charge
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
即将公布