Dr. Tim Yeh

Corporate VP, Director of Substrate Packaging TD
Intel

VP Global Semiconductor Operations/COO
Nextlens

VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
AMAT

VP
Alibaba Group

GM & EVP for Advanced Optical Sensors Division
ams

Asst. President, Director of Strategy Development
清华大学苏州汽车研究院（吴江）

VP & GM Industrial Fiber Products Division
Broadcom

首席执行官
Axera Technology Co., Ltd

Senior Director
CR Micro

Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
Formfactor

Professor
Fudan University

Co-founder & CEO
GS Microelectronics

Formerly VP New Fab Project
Formerly of GTA

工艺技术总监
Hangzhou Silan Microelectronics Co Ltd

先进模块研发部，副部长
HLMC

VP, GM of Technology R&D Center
长电科技

Professor
IME, Tsinghua University

Researcher Professor
Institute of Microelectronics, Chinese Academy of Sciences

Chairman and CEO
摩尔精英

Chairman / Chairman & CEO
OSFPGA Foundation / Rapid Silicon

VP & Head, Semiconductor Manufacturing
Reliance India Ltd.

In Transition
Formerly of Spin Memory

GM
Suzhou Semitop Semiconductor Co Ltd

先进封装CTO
通富微电子股份有限公司

首席执行官
TRS China

COO
Yangtze Memory Technologies Co., Ltd (YMTC)

Chairman / EVP
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group