Chair: Dr. Hamid Azimi
Intel
Santosh Kumar formerly worked as Director & Principal Analyst at Yole Développement, where he was involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging.
He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
即将公布
中國國際半導體高峰會
2023.10.17-18
晶圆厂 / 封装测试厂 / 集成电路设计公司 / 终端用户
Memberships are based on calendar year. It commences 1st January 2023 and ends on 31st December 2023.
所有额外的活动通行证将以较低的会员费率注册。
注册ISES活动通行证时节省会员费用的一个例子。
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
Member Rate: $800 per person
Non-Member Rate: $2,800 per person
Plus 7.5% service charge
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
即将公布