
顾问委员会
Santosh Kumar
Santosh Kumar formerly worked as Director & Principal Analyst at Yole Développement, where he was involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging.
He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

Reliance India Ltd.
即将公布
顾问委员会
Chair: Dr. Hamid Azimi
Intel
Deputy Chair: Markus Keil
Nextlens
Vincent DiCaprio
AMAT
Dr. Xiaoning Qi
Alibaba Group
Jennifer Zhao
ams
王微
清华大学苏州汽车研究院(吴江)
Martin Weigert
Broadcom
仇肖莘博士
Axera Technology Co., Ltd
郑晨焱
CR Micro
Amy Leong
Formfactor
Dr. Qingchun Zhang
Fudan University
Farhat Jahangir
GS Microelectronics
汪国兴
Formerly of GTA
闻永祥
Hangzhou Silan Microelectronics Co Ltd
傅昶
HLMC
Yaojian Lin
长电科技
魏少军教授
IME, Tsinghua University
叶甜春教授
Institute of Microelectronics, Chinese Academy of Sciences
JY Zhang
摩尔精英
Dr. Naveed Sherwani
OSFPGA Foundation / Rapid Silicon
Dr. Tim Yeh
Sanan IC
Andrew Peng
Formerly of Spin Memory
Joseph Chou
Suzhou Semitop Semiconductor Co Ltd
郑子企博士
通富微电子股份有限公司
YC Lee
TRS China
Weihua Cheng
Yangtze Memory Technologies Co., Ltd (YMTC)
李炜博士
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group