
顾问委员会
Vincent DiCaprio
Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES.
Currently leading Corporate and Business Development for the Advanced Packaging and ICAPS division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. Vincent leads all aspects of critical technology inflections related to Heterogenous Integrated, next generation integration of Silicon, volumetric scaling for all key aspects of the technology stack related to system level solutions.
With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30+ Patents in the field of advanced semiconductor packaging.
For more information please visit: linkedin.com/in/vincentdicaprio

AMAT
即将公布
顾问委员会
Chair: Dr. Hamid Azimi
Intel
Deputy Chair: Markus Keil
Nextlens
Dr. Xiaoning Qi
Alibaba Group
Jennifer Zhao
ams
王微
清华大学苏州汽车研究院(吴江)
Martin Weigert
Broadcom
仇肖莘博士
Axera Technology Co., Ltd
郑晨焱
CR Micro
Amy Leong
Formfactor
Dr. Qingchun Zhang
Fudan University
Farhat Jahangir
GS Microelectronics
汪国兴
Formerly of GTA
闻永祥
Hangzhou Silan Microelectronics Co Ltd
傅昶
HLMC
Yaojian Lin
长电科技
魏少军教授
IME, Tsinghua University
叶甜春教授
Institute of Microelectronics, Chinese Academy of Sciences
JY Zhang
摩尔精英
Dr. Naveed Sherwani
OSFPGA Foundation / Rapid Silicon
Santosh Kumar
Reliance India Ltd.
Dr. Tim Yeh
Sanan IC
Andrew Peng
Formerly of Spin Memory
Joseph Chou
Suzhou Semitop Semiconductor Co Ltd
郑子企博士
通富微电子股份有限公司
YC Lee
TRS China
Weihua Cheng
Yangtze Memory Technologies Co., Ltd (YMTC)
李炜博士
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group