
顾问委员会
Yaojian Lin
Mr. Lin, Yaojian holds B.S. degree in Metal Materials & Heat Treatment from Huazhong University of Science and Technology with Honor of Outstanding Graduate, M.S. degree in Composite Materials from Shanghai Jiaotong University, and M.S. degree in Materials Science from University of Rochester, NY, United States. He once worked at Shanghai Jiaotong University, Lucent Bell Labs/Sychip, and STATS ChipPAC (Singapore), and is now VP of Corporate & GM of Technology R&D Center. He has over 20 years R&D and Technology Transfer Experience in Materials and Semiconductor Packaging development, especially in wafer level package and advanced packaging. He has hands-on experiences in end-to-end technology & product development from conceptual to high volume manufacturing in IPD, Wafer Bumping, WLCSP, eWLB/eWLCSP, 2.5D Fan-out & fcBGA, fcCSP and advanced SiP. He is the inventor/co-inventor of 200+ granted US patents in semiconductor packaging.

长电科技
即将公布
顾问委员会
Chair: Dr. Hamid Azimi
Intel
Deputy Chair: Markus Keil
Nextlens
Vincent DiCaprio
AMAT
Dr. Xiaoning Qi
Alibaba Group
Jennifer Zhao
ams
王微
清华大学苏州汽车研究院(吴江)
Martin Weigert
Broadcom
仇肖莘博士
Axera Technology Co., Ltd
郑晨焱
CR Micro
Amy Leong
Formfactor
Dr. Qingchun Zhang
Fudan University
Farhat Jahangir
GS Microelectronics
汪国兴
Formerly of GTA
闻永祥
Hangzhou Silan Microelectronics Co Ltd
傅昶
HLMC
魏少军教授
IME, Tsinghua University
叶甜春教授
Institute of Microelectronics, Chinese Academy of Sciences
JY Zhang
摩尔精英
Dr. Naveed Sherwani
OSFPGA Foundation / Rapid Silicon
Santosh Kumar
Reliance India Ltd.
Dr. Tim Yeh
Sanan IC
Andrew Peng
Formerly of Spin Memory
Joseph Chou
Suzhou Semitop Semiconductor Co Ltd
郑子企博士
通富微电子股份有限公司
YC Lee
TRS China
Weihua Cheng
Yangtze Memory Technologies Co., Ltd (YMTC)
李炜博士
Zing Semiconductor & SIMGUI Technology / National Silicon Industry Group