Chair: Dr. Hamid Azimi
Intel
Mr. Lin, Yaojian holds B.S. degree in Metal Materials & Heat Treatment from Huazhong University of Science and Technology with Honor of Outstanding Graduate, M.S. degree in Composite Materials from Shanghai Jiaotong University, and M.S. degree in Materials Science from University of Rochester, NY, United States. He once worked at Shanghai Jiaotong University, Lucent Bell Labs/Sychip, and STATS ChipPAC (Singapore), and is now VP of Corporate & GM of Technology R&D Center. He has over 20 years R&D and Technology Transfer Experience in Materials and Semiconductor Packaging development, especially in wafer level package and advanced packaging. He has hands-on experiences in end-to-end technology & product development from conceptual to high volume manufacturing in IPD, Wafer Bumping, WLCSP, eWLB/eWLCSP, 2.5D Fan-out & fcBGA, fcCSP and advanced SiP. He is the inventor/co-inventor of 200+ granted US patents in semiconductor packaging.
即将公布
中國國際半導體高峰會
2023.10.17-18
晶圆厂 / 封装测试厂 / 集成电路设计公司 / 终端用户
Memberships are based on calendar year. It commences 1st January 2023 and ends on 31st December 2023.
所有额外的活动通行证将以较低的会员费率注册。
注册ISES活动通行证时节省会员费用的一个例子。
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
Member Rate: $800 per person
Non-Member Rate: $2,800 per person
Plus 7.5% service charge
晶圆厂 | 封装测试厂 | 集成电路设计公司 | 终端用户
即将公布