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2023年演讲者

张中

  • 江苏芯德半导体科技有限公司
  • 副总经理, 高级工程师
  • 简介

VP of JSSI with 20+ years R&D and PM experience in advanced package area, full global OSAT operation experience. He holds more than 25+ patents in 2.5D PKG area and worked in global enterprise like SPIL, TI.

  • 演讲内容

用于 Chiplet 设计的存储器和处理器

Recent application of AI drives strong demand for HPC chip, and in the latest technology, 2.5D& 3D package solution provides the best electrical performance for these type chips; In this presentation, speech will focus on the CHIPLET design challenge which focus on the HBM& Logic chip multi connection.

JSSI semi logo
  • 公司简介

江苏芯德半导体科技有限公司

JSSI, registered in Sep’2020 in Nanjing，Jiangsu Province, P.R.C, and factory located in the same industry park with TSMC-12inch Nanjing Plant. JSSI business focus on Semiconductor Assembly & Test service including Bumping/WLCSP/eWLB/WB-FCQFN/LGA/BGA/2.5D package solution. JSSI core management and R & D team worked in advanced package area more than 20 years, and company committed to provide first-class technology services for customers; JSSI factory has 1700+ employees and obtained ISO9001, QC080000, ISO14001, ISO27001，TS16949 and other system certifications. JSSI R&D team worked with several key GPU/CPU design house to focus on the 2.5D PKG design and test vehicle sample manufacturing now.

2023年演讲者

2023议程

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