2023年演讲者

阮文彪博士

厦门云天半导体科技有限公司
研发总监

简介

中科院博士，电子学与固体电子学专业，现任厦门云天半导体科技有限公司研发部总监，负责玻璃通孔(TGV)、扇出型封装(WL-FO)、晶圆级封装技术、玻璃基高频器件等工艺研发。先后在中芯国际集成电路制造有限公司、中国科学院微电子研究所、北京地太科特技术有限公司任职。2010年在中科院微电子研究所被聘为副研究员，开展65纳米及以下集成电路制造工艺建模和可制造性设计方法学研究，参与和完成多项国家重大专项课题研究。发表文章10多篇，申请专利18项。

演讲内容

基于玻璃衬底和TGV工艺的Chiplet工艺集成

孔径可小于15微米，金属填充能力深宽比达到10：1，采用高密度中介层布线，其中最小线宽线距可小于1.5um，满足高性能存储器、CPU等高密度互连的需求。整个封装体将玻璃作为中介层的核心层，采用“RDL-First”工艺将芯片倒装于多层RDL布线层，实现电气互连，对比TSV，降低了寄生电容、电感效应，减小了传输信号延时，可广泛应用在高频传输领域当中。

公司简介

厦门云天半导体科技有限公司

Founded in July 2018, Xiamen Sky-semi commits to the development and industrialization of advanced packaging and system integration technology for high-speed and high-frequency communication applications. Through independent R&D and collaborative innovation, we provide customers with integrated solutions and services from collaborative product design, process research and development to mass production.

The main business of Xiamen Sky-semi includes Wafer Level 3D Package (WLP), Fan Out Package (FO), System in Package (SIP) and Module, IPD device manufacturing, High Density Glass Through Via (TGV) technology, manufacturing of high precision antenna ,etc. We have provided design, packaging and integration services for nearly 100 customers at home and abroad。Sky-semi has a core team with outstanding innovation ability that has broken through a series of core and key technologies and has full range of wafer level system packaging as well as precision manufacturing capabilities from 4 inch, 6 inch, 8 inch to 12 inch.

Sky-semi Semiconductor based on technological innovation embarking on seize the historical opportunity to achieve leapfrog development in the new era of global semiconductor industry competition pattern by adhere to customer-centered ，Innovative and progressing philosophy，5G application as a breakthrough.