Laurent Giai-Miniet photo

Laurent Giai-Miniet

  • ERS Electronic GmbH
  • 執行長
  • 简介

Laurent先生是ERS electronic公司CEO,主要管理公司销售、市场、应用和业务扩展部门。他在半导体行业有着超过25年的经验,曾在德州仪器和英飞凌等知名公司及高科技创业公司担任领导职务。Giai-Miniet先生拥有Aix-en-Provence企业管理学院的MBA学位。

  • 演讲内容




ERS logo
  • 公司简介

ERS Electronic GmbH

ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales and support offices worldwide.

Phone: +49 898941320

Products and Services

ERS electronic GmbH has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.

Leveraging more than 50 years of thermal management expertise, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Advanced Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Fan-out space, by supporting different wafer formats and panels. The company’s most recent innovation is called Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute.

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