2023年演讲者

Laurent Giai-Miniet

ERS Electronic GmbH
執行長

简介

Laurent先生是ERS electronic公司CEO，主要管理公司销售、市场、应用和业务扩展部门。他在半导体行业有着超过25年的经验，曾在德州仪器和英飞凌等知名公司及高科技创业公司担任领导职务。Giai-Miniet先生拥有Aix-en-Provence企业管理学院的MBA学位。

演讲内容

突破温度管理极限以应对晶圆封测中的挑战

在技术飞速发展的当下，半导体行业需要不断突破创新以满足日益复杂的需求。随着人工智能的普及和对新能源的旺盛需求，温度管理越来越重要。随着半导体器件尺寸的不断缩小和复杂性的增加，功率密度随之增高，导致工作温度不断升高。这给晶圆测试在温度精度和均匀性方面带来了严峻的挑战，因为即使是微小的温度偏差也会严重影响这些芯片的性能和可靠性。

本次演讲将针对该方面带来ERS在晶圆探测和先进封装，两个可以最大限度地提高产量和保证芯片性能方面的最新研发。

公司简介

ERS Electronic GmbH

ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales and support offices worldwide.

Phone: +49 898941320
Email:
Website: www.ers-gmbh.com

Products and Services

ERS electronic GmbH has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.

Leveraging more than 50 years of thermal management expertise, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Advanced Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Fan-out space, by supporting different wafer formats and panels. The company’s most recent innovation is called Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute.

For more information, please visit: www.ers-gmbh.com