主旨: Rahul Manepalli

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) package technology. His team was recently awarded an Intel achievement award for EMIB innovations. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

Innovations in advanced packaging to enable next generation heterogenous devices!

Heterogenous device integration has become a critical capability need for the next generation of AI, Data Center, Graphics and FPGA devices. Advanced packaging technologies such as EMIB, Foveros & Co-EMIB are now enabling a dramatic increase in interconnect density and bandwidth, enabling integration of multiple types of heterogenous die (Logic, memory, transceiver and multiple nodes) onto a single package. In addition to dense die to die interconnect, there is a need for advances in power delivery, high speed I/O interconnects and thermal cooling technologies to enable of next generation of heterogenous devices. In this talk, we will provide an overview of recent advances in advanced die to die interconnect technologies, innovations in power delivery, technologies that enabling high speed I/O interconnects and thermal cooling innovations. We will also discuss technical challenges and advancements needed to drive the packaging technology roadmap forward.